Cogent’s Electronic Parts Testing Process (SAE AS6081)
Perform Label and Packaging Inspection on all devices.
Perform Radiological (X-Ray) Inspection on 50 devices.
Perform Program Test for IC devices. (such as STM MCU and CPU series products)
Perform Slice Test for the Tiny devices. (such as Resistance Capacitance and MLCC)
Delid/Decapsulation Physical Analysis on 1 device minimum.
Verification of Purchased Product Complete.
Cogent’s Shipping Labal and Order Complete.
